China’s JCET to build new plant in Shanghai to expand advanced chip packaging - SCMP

China’s JCET Group (600584.SH) is advancing its position in the global semiconductor industry with the development of a new advanced chip packaging facility in Shanghai. The project, led by JCET Automotive Electronics (Shanghai) Co., Ltd., a subsidiary of JCET, has secured RMB 4.4 billion capital increase to support construction of the intelligent automotive-grade chip packaging flagship factory. Located in the Lingang industrial hub, the facility will span over 130,000 square meters, with a dedicated factory area of approximately 200,000 square meters. Construction began in August 2023, with equipment entry expected in the first half of 2025.

The new plant will focus on packaging automotive computing chips, power modules, and other advanced applications, leveraging JCET’s industry-leading technology and automation solutions. The facility is expected to serve a wide range of automotive applications, including ADAS sensors, high-performance computing, and vehicle networking, supporting growing demand for intelligent automotive systems.

This expansion aligns with JCET’s broader strategy to strengthen its market position in the chip manufacturing sector. The company has already made significant investments in high-end packaging technologies, including a CNY 10 billion project in Jiangsu Province, which is expected to achieve annual production capacity of 6 billion high-end advanced packaging chips. These developments underscore JCET’s commitment to enhancing its global competitiveness in the integrated circuit industry.