UMC: Co-president Jason Wang named D CEO

AI Summary2 min read

TL;DR

UMC co-president Jason Wang, overseeing strategy and sales, has led key initiatives like the 2024 Intel partnership for 12nm technology, driving business expansion and customer focus in the semiconductor market.

Tags

UMCJason WangsemiconductorIntel partnershipleadership

UMC: Co-president Jason Wang named D CEO

UMC: Co-President Jason Wang’s Leadership and Strategic Role

United Microelectronics Corporation (UMC), a leading global semiconductor foundry, has maintained a leadership structure featuring co-presidents since 2017, with Jason Wang sharing responsibilities alongside SC Chien. Appointed co-president following the retirement of former CEO Po-Wen Yen, Wang oversees corporate strategy, sales, marketing, and customer engineering, while Chien focuses on manufacturing, technology development, and R&D according to company announcements.

Wang joined UMC in 2008 as Vice President of Corporate Marketing and previously served as President of UMC-USA and Senior Vice President of Worldwide Sales and Corporate Marketing. Prior to UMC, he spent 18 years at Trident Microsystems, where he led strategic restructuring efforts. His leadership at UMC has emphasized business expansion and customer-centric operations, aligning with the company's focus on mature nodes and specialty technologies.

Recent developments highlight UMC's strategic collaborations under Wang's tenure. In 2024, UMC partnered with Intel to develop a 12-nanometer semiconductor process platform, leveraging Intel's U.S. manufacturing capacity and UMC's foundry expertise. The collaboration aims to address high-growth markets such as mobile and networking while diversifying supply chains as reported. Wang described the partnership as a "step forward" in advancing UMC's capacity expansion and technology roadmap, underscoring the company's commitment to cost-efficient innovation according to Intel's press release.

Financially, UMC has demonstrated resilience. As of early 2026, the company operates 12 wafer fabrication facilities with a combined monthly capacity exceeding 880,000 wafers (8-inch equivalent) and holds a market capitalization of approximately $5.01 billion. Its 14nm FinFET technology, introduced in 2017, remains a key offering, with ongoing advancements in power efficiency and gate density supporting demand from IoT and consumer electronics clients.

UMC's governance structure, featuring a board-led executive team, continues to prioritize operational efficiency and technological leadership. With Wang and Chien at the helm, the company remains positioned to navigate evolving semiconductor market dynamics while expanding its global footprint.

[^NUMBER references correspond to the provided source materials.]

UMC: Co-president Jason Wang named D CEO

Visit Website