Hanmi Semiconductor Co Ltd - Q2 operating profit 130 bln won, up 51% y/y

Hanmi Semiconductor Co Ltd reported a second-quarter operating profit of 130.3 billion won ($87.4 million), representing a 51% year-on-year increase. Consolidated revenue for the quarter reached 251.1 billion won ($168.4 million), up 39.5% compared to the same period in 2025. The company’s operating margin hit a record high of 51.9%, reflecting strong performance across its core product lines.

The surge in profitability was driven by increased demand for thermal compression (TC) bonders and "Micro Saw & Vision Placement" (MSVP) equipment, which are critical for high-bandwidth memory (HBM) production. As global memory manufacturers ramp up investments in HBM4 and prepare for HBM4E, Hanmi Semiconductor has seen a significant rise in orders for its advanced packaging and bonding solutions.

The company’s second-quarter results marked a sharp turnaround from the first quarter, when operating profit fell 87.9% year-on-year. This earnings rebound exceeded market expectations, surpassing the consensus forecast by 18%. Hanmi Semiconductor attributed the strong performance to the resumption of major client orders following a temporary slowdown during the transition from HBM3E to HBM4.

Looking ahead, Hanmi Semiconductor is preparing for continued growth by expanding its production capacity and developing next-generation equipment. The company plans to launch a wide TC bonder in 2027 and has begun construction of a hybrid bonder factory in Incheon. Additionally, it is investing in 2.5D packaging equipment to meet the rising demand from AI semiconductor manufacturers.

Hanmi Semiconductor’s stock has shown strong momentum, with the share price rising 242.2% over the past year. The company’s leadership, including CEO Dong Sin Gwak, has continued to express confidence in its long-term prospects, with ongoing treasury stock purchases signaling optimism about future earnings growth.