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An earthquake on a chip: New tech could make smartphones smaller, faster - Tech Xplore

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TL;DR

New technology using surface acoustic wave phonon lasers on chips could enable smaller, faster smartphones by generating tiny 'earthquakes' for improved wireless capabilities.

  1. An earthquake on a chip: New tech could make smartphones smaller, faster  Tech Xplore
  2. An electrically injected solid-state surface acoustic wave phonon laser  Nature
  3. “The Waves From an Earthquake, Only On the Surface of a Small Chip”: This Vibrating Laser May Be the Future of Wireless Technology  The Debrief
  4. Tiny ‘earthquake-on-a-chip’ phonon laser aims to shrink smartphone wireless hardware  Bez Kabli
  5. This chip can make future phones thinner and faster through tiny ‘earthquakes’  Digital Trends

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